AI-Driven Process Optimization in Automated Microsoldering for Fine-Pitch PCB Assembly. International Journal of Humanities and Information Technology, [S. l.], v. 5, n. 01, p. 27–47, 2023. DOI: 10.21590/ijhit.05.01.4. Disponível em: https://ijhit.info/index.php/ijhit/article/view/130. Acesso em: 25 jun. 2026.